小切深条件下磨削表面完整性变化机理

修世超;白斌;韦建很;刘明贺;

Changing mechanism of grinding surface integrity under small cutting depth conditions

Xiu, Shi-Chao (1); Bai, Bin (1); Wei, Jian-Hen (1); Liu, Ming-He (1)

东北大学学报(自然科学版) . 2012, (9): 1327 -1330 . DOI: -