大长径比微圆柱阵列工具电极的制备

doi:10.12068/j.issn.1005-3026.2025.20240107

摘要/Abstract

摘要：

针对大长径比微圆柱阵列电极制备难度大、工艺复杂等问题，基于微正四棱柱电极电蚀致截面变圆形的特殊现象，提出一种多次迭代加工新工艺方法，以高质、高效制备大长径比微圆柱阵列电极.通过实验验证了该方法的可行性，并对比了不同电极材料（铜、铜钨合金）对加工性能的影响.结果表明，与铜钨合金相比，铜材料电极迭代制备微圆柱阵列电极所需的迭代次数更少.制备出的铜和铜钨合金6 $×$ 6微圆柱阵列电极的长径比分别为6.08，8.81，加工得到的阵列圆孔直径标准差分别为8.48，8.18 μm.

关键词: 微圆柱, 微棱柱, 阵列电极, 阵列圆孔, 电火花加工

Abstract:

In view of the difficulty and complexity in the preparation of microcylindrical array electrodes with a large aspect ratio， a new process method with multiple iterations based on the special phenomenon of rounded cross-section caused by galvanic corrosion of micro-normal tetragonal electrodes was proposed， so as to achieve high-quality and high-efficiency preparation of microcylindrical array electrodes with a large aspect ratio.The feasibility of the method was verified experimentally， and the effects of different electrode materials （copper and copper-tungsten alloy） on the processing performance were compared.The results show that fewer iterations are required for the iterative preparation of microcylindrical array electrodes for copper electrodes compared with copper-tungsten alloys.The large aspect ratios of the prepared 6 $×$ 6 microcylindrical array electrodes of prepared copper and copper-tungsten alloy are 6.08 and 8.81， respectively， and the standard deviations of the diameters of circular holes in the processed array are 8.48 μm and 8.18 μm， respectively.

Key words: microcylinder, microprism, array electrode, circular hole in array, electrical discharge machining

中图分类号:

TG 132.3

金丽雅, 巩亚东, 朱容迪, 高鸿飞. 大长径比微圆柱阵列工具电极的制备[J]. 东北大学学报（自然科学版）, 2025, 46(11): 98-105.

Li-ya JIN, Ya-dong GONG, Rong-di ZHU, Hong-fei GAO. Preparation of Microcylindrical Array Tool Electrode with Large Aspect Ratio[J]. Journal of Northeastern University(Natural Science), 2025, 46(11): 98-105.

图/表 14

图1 微棱柱阵列电极加工结果（a）—Cu的6×6微棱柱阵列电极；（b）—CuW70的6×6微棱柱阵列电极.

Fig.1 Processing results of microprismatic array electrodes

图2 微圆柱阵列电极加工方法示意图

Fig.2 Schematic diagram of microcylindrical array electrode processing method

图3 加工次数对微棱柱阵列电极轴向损耗长度的影响（a）—铜；（b）—铜钨合金.

Fig.3 Effect of numbers of processing operations on axial wear length of microprismatic array electrodes

图4 不同材料的微棱柱阵列电极加工微阵列孔所用时间

Fig.4 Time required to process microarray holes for microprismatic array electrodes of different materials

图5 微棱柱阵列电极损耗形貌分析（a）—铜电极；（b）—铜钨合金电极；（c）—线轮廓；（d）—异形微阵列孔.

Fig.5 Morphological analysis of electrode loss in microprismatic arrays

图6 不同材料的微棱柱阵列电极的损耗长度（a）—铜电极；（b）—铜钨合金电极；（c）—损耗长度.

Fig.6 Loss length of microprismatic array electrodes of different materials

图7 过渡阶段铜钨合金微阵列电极形貌

Fig.7 Morphology of microarray electrodes of copper-tungsten alloy in transition stage

图8 铜电极加工过程中迭代次数对微阵列孔出口的影响（a）—形貌；（b）—尺寸.

Fig.8 Effect of numbers of iterations on microarray hole exit during copper electrode processing

图9 铜钨合金电极加工过程中迭代次数对微阵列孔出口的影响（a）—形貌；（b）—尺寸.

Fig.9 Effect of number of iterations on microarray hole exit during copper-tungsten alloy electrode processing

图10 不同材料的6×6微圆柱阵列电极（a）—铜；（b）—铜钨合金.

Fig.10 6×6 microcylindrical array electrodes of different materials

图11 不同材料电极加工的阵列圆孔的尺寸（a）—铜；（b）—铜钨合金.

Fig.11 Dimensions of circular holes in processed array from electrodes of different materials

图12 不同材料电极的表面微观形貌

Fig.12 Surface microscopic morphology of

图13 不同材料电极的线轮廓及表面粗糙度（a）—铜；（b）—铜钨合金；（c）—表面粗糙度.

Fig.13 Line profile and surface roughness of electrodes of different materials

图14 铜电极表面EDS分析（a）—电极表面微观形貌；（b）—M点EDS分析谱图及元素质量分数.

Fig.14 EDS analysis of copper electrode surfaces

参考文献 15

[1]	Kashani R G， Henslee A， Nelson R F， et al.Robotic assistance during cochlear implantation： the rationale for consistent， controlled speed of electrode array insertion［J］.Frontiers in Neurology， 2024， 15： 1335994.
[2]	Brunn L， Neighbors E， Martin R.Transcutaneous spinal cord simulation with novel electrode array improves walking in a patient with incomplete spinal cord injury［J］.Archives of Physical Medicine and Rehabilitation，2024，105（4）：e107.
[3]	Liu H， Bai J C， Zhang B，et al.Breakthrough detection and servo control for micro‑hole array EDM drilling［J］.The International Journal of Advanced Manufacturing Technology， 2022，119（1/2）：615-629.
[4]	Cheng E， Zhu Y M， Deng Q B，et al.Fabrication of micro‑ultrasonic phased array electrode via electric field‑driven printing method［J］.Journal of Micromechanics and Microengineering，2024，34（4）： 045012.
[5]	Takahata K， Gianchandani Y B.Batch mode micro‑electro‑discharge machining［J］.Journal of Microelectromechanical Systems， 2002， 11（2）： 102-110.
[6]	Singh S， Pandey A.Some studies into electrical discharge machining of Nimonic75 super alloy using rotary copper disk electrode［J］.Journal of Materials Engineering and Performance， 2013， 22（5）： 1290-1303.
[7]	孙瑶，唐本甲，巩亚东，等.镍基单晶高温合金表面微阵列孔的制备方法及其实验研究［J］.东北大学学报（自然科学版），2023，44（12）：1719-1725.
	Sun Yao， Tang Ben-jia， Gong Ya‑dong，et al.Preparation method and experimental study of array microholes on the surface of nickel-based single crystal superalloy ［J］.Journal of Northeastern University （Natural Science），2023，44（12）：1719-1725.
[8]	Tkadletz M， Waldl H， Schiester M， et al.Efficient preparation of microtip arrays for atom probe tomography using FS-laser processing［J］.Ultramicroscopy， 2023， 246： 113672.
[9]	Song M C， Zhao H， Liu J S， et al.Replication of large scale micro pillar array with different diameters by micro injection molding［J］.Microsystem Technologies，2017，23（6）：2087-2096.
[10]	Jin L Y， Gong Y D， Sun Y，et al.Research on surface quality and tool wear of micro‑groove array machined by a novel micro‑milling cutter［J］.The International Journal of Advanced Manufacturing Technology，2022，121（3）：2383-2397.
[11]	Liang Z Q， Su Z P， Du Y C，et al.Research on design and fabrication of micro ball end milling tool with flat edge and conical flank［J］.Precision Engineering，2023， 79： 323-334.
[12]	Jin L Y， Gong Y D， Hu Y T，et al.Experimental study on the influence of workpiece shape on discharge gap and burr in LS-WEDM and the preparation of microelectrode array with specific size［J］.The International Journal of Advanced Manufacturing Technology，2024，130（11/12）：5965-5977.
[13]	Chen S T.A high‑efficiency approach for fabricating mass micro holes by batch micro EDM［J］.Journal of micromechanics and microengineering，2007，17（10）： 1961-1970.
[14]	Wang Y K， Wang Z L， Li M S，et al.Microelectrode array fabrication by micro-WEDM［J］.Advanced Materials Research，2009， 69/70： 79-82.
[15]	解宝成.微小孔及阵列孔微细电火花加工的若干基础问题研究［D］.哈尔滨：哈尔滨工业大学，2013.
	Xie Bao‑cheng.Research on several basic problems for micro-EDM of micro hole and array holes［D］.Harbin：Harbin Institute of Technology，2013.