东北大学学报(自然科学版) ›› 2005, Vol. 26 ›› Issue (3): 282-284.DOI: -

• 论著 • 上一篇    下一篇

“两步”法镁合金化学镀镍的研究

李建中;邵忠财;郝建军;田彦文   

  1. 东北大学材料与冶金学院;沈阳理工大学环境与化学工程学院;东北大学材料与冶金学院;东北大学材料与冶金学院 辽宁沈阳 110004
  • 收稿日期:2013-06-24 修回日期:2013-06-24 出版日期:2005-03-15 发布日期:2013-06-24
  • 通讯作者: Tian, Y.-W.
  • 作者简介:-
  • 基金资助:
    辽宁省自然科学基金资助项目(002054)·

Two-steps electroless nickel plating of magnesium alloys

Li, Jian-Zhong (1); Shao, Zhong-Cai (2); Hao, Jian-Jun (1); Tian, Yan-Wen (1)   

  1. (1) Sch. of Mat. and Metall., Northeastern Univ., Shenyang 110004, China; (2) Faculty of Environ. and Chem. Eng., Shenyang Ligong Univ., Shenyang 110168, China
  • Received:2013-06-24 Revised:2013-06-24 Online:2005-03-15 Published:2013-06-24
  • Contact: Tian, Y.-W.
  • About author:-
  • Supported by:
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摘要: 以硫酸镍为主盐,研究了镁合金"两步"化学镀镍工艺·利用扫描电子显微镜(SEM)、能谱分析(EDS)和X射线衍射仪检测镁合金"两步"化学镀膜的表面形貌、成分及相结构,利用增重法研究了化学镀速度,并通过锉刀试验评价镀层与基体的结合力·结果表明,在直接化学镀4min后可以实现以硫酸镍为主盐的第二步化学镀镍;"两步"化学镀层为高磷非晶态,表面光亮,耐蚀性良好;且镀层与基体结合力好·"两步"化学镀不仅其镀速快于单一直接化学镀,而且可以优化镁合金化学镀速度与相结构的结合,有效地调整镀层磷含量分布;以硫酸镍为主盐"两步"化学镀能降低镁合金化学镀成本,提高其实用性·

关键词: 镁合金, 硫酸镍, "两步"化学镀, 结合力, 化学镀层, 耐蚀性

Abstract: The two-step electroless nickel plating (TSENP) of magnesium alloys using NiSO4·6H2O as the main salt was introduced. The morphology, composition and phase structure of TSENP coatings were investigated by means of Scanning Electron Microscopy (SEM), Energy Dispersive X-ray Spectroscopy (EDS) and X-ray Diffraction (XRD). In addition, the coating growth rate was tested through weighing by electro-balance and the bonding strength between coating and substrate was evaluated through file-checking. The results showed that the plating of magnesium alloys with NiSO4·6H2O solution as the main salt, i. e., the 2nd step should be carried out successively 4 minutes after the direct land electroless nickel plating (DENP). It was verified that the coating growth rate of single DENP is lower than that of TSENP, the sheeny TSENP coating is of high-phosphorus amorphism with higher corrosion resistance and bonding strength than DENP coating. The P content in weight is effectively distributed in the coating. In short, TSENP will not only decrease the cost but improve the applicability.

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