废弃电路板铜锡多金属粉隔膜电积回收锡实验研究
杨建广， 陈冰， 雷杰， 李树超
Experimental Study on Tin Recovery Based on Membrane Electrodeposition from Metal Fractions of Waste Printed Circuit Boards
YANG Jian-guang， CHEN Bing， LEI Jie， LI Shu-chao
东北大学学报:自然科学版
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2017, (11): 1648
-1653
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DOI: 10.12068/j.issn.1005-3026.2017.11.026
