废弃电路板铜锡多金属粉隔膜电积回收锡实验研究

doi:10.12068/j.issn.1005-3026.2017.11.026

东北大学学报:自然科学版 ›› 2017, Vol. 38 ›› Issue (11): 1648-1653.DOI: 10.12068/j.issn.1005-3026.2017.11.026

废弃电路板铜锡多金属粉隔膜电积回收锡实验研究

杨建广，陈冰，雷杰，李树超

(中南大学冶金与环境学院，湖南长沙410083)

收稿日期:2016-05-03 修回日期:2016-05-03 出版日期:2017-11-15 发布日期:2017-11-13
通讯作者: 杨建广
作者简介:杨建广(1976-)，男，湖南长沙人，中南大学教授.
基金资助:
国家自然科学基金资助项目(51174237，51574294)；中南大学创新驱动项目(2015CX001).

Experimental Study on Tin Recovery Based on Membrane Electrodeposition from Metal Fractions of Waste Printed Circuit Boards

YANG Jian-guang， CHEN Bing， LEI Jie， LI Shu-chao

School of Metallurgy and Environmental， Central South University， Changsha 410083， China.

Received:2016-05-03 Revised:2016-05-03 Online:2017-11-15 Published:2017-11-13
Contact: YANG Jian-guang
About author:-
Supported by:
-

摘要/Abstract

摘要： 采用基于隔膜电积湿法冶金新工艺从废弃电路板铜锡多金属粉中高效提取金属锡，研究并优化了铜锡多金属粉浸出及隔膜电积提锡工艺.浸出实验结果表明，在温度为40℃，初始Sn⁴⁺质量浓度50g/L，HCl浓度4mol/L，液固比为5∶1，循环浸出三次的条件下，锡浸出率约为96%，最终浸出液中Sn²⁺质量浓度68.58g/Ｌ.锡隔膜电积实验表明，在Sn²⁺质量浓度40~100g/L，HCl浓度3mol/L，温度35℃，电流密度200A/m²的条件下，阴极电流效率97.51%，能耗低于1200kWh/t.在此优化条件下进行隔膜电积8h，得到平整、致密且纯度99.9%的阴极锡板.

关键词: 废弃电路板, 锡回收, 氯化浸出, 隔膜电积

Abstract: A new hydrometallurgical progress based on membrane electrodeposition was proposed to effectively extract tin from metal fractions of WPCBs(waste printed circuit boards). Leaching experiment results showed that under the conditions of temperature 40℃， Sn⁴⁺ concentration 50g/L， HCl concentration 4mol/L， liquid (ml) to solid (g) ratio 5∶1 and cycle 3 times， the leaching efficiency of tin was about 96%， and the resultant Sn²⁺ concentrated in the leach solution was 68.58g/L. The electrodeposition tests indicated that under the condition of current density 200A/m²， temperature 35℃， H⁺ concentration 3mol/L and Sn²⁺ concentration 40~100g/L， a compact and smooth cathode tin layer can be obtained after 8h electrodeposition. The current efficiency was 97.51% and the electric consumption was less than 1200kW h/t.

Key words: waste printed circuit boards;tin recovery, chlorination leaching, membrane electrodeposition

中图分类号:

TF805.2

杨建广，陈冰，雷杰，李树超. 废弃电路板铜锡多金属粉隔膜电积回收锡实验研究[J]. 东北大学学报:自然科学版, 2017, 38(11): 1648-1653.

YANG Jian-guang， CHEN Bing， LEI Jie， LI Shu-chao. Experimental Study on Tin Recovery Based on Membrane Electrodeposition from Metal Fractions of Waste Printed Circuit Boards[J]. Journal of Northeastern University Natural Science, 2017, 38(11): 1648-1653.

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废弃电路板铜锡多金属粉隔膜电积回收锡实验研究

Experimental Study on Tin Recovery Based on Membrane Electrodeposition from Metal Fractions of Waste Printed Circuit Boards

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