东北大学学报（自然科学版）

东北大学学报(自然科学版) ›› 2010, Vol. 31 ›› Issue (8): 1149-1152.DOI: -

• 论著 • 上一篇    下一篇

TMPAC-AlCl_3离子液体电镀铝研究

柳泉;刘奎仁;韩庆;涂赣峰;   

  1. 东北大学材料与冶金学院;
  • 收稿日期:2013-06-20 修回日期:2013-06-20 出版日期:2010-08-15 发布日期:2013-06-20
  • 通讯作者: -
  • 作者简介:-
  • 基金资助:
    国家高技术研究发展计划项目(2004AA001220)

Study on Al-electrodeposition from TMPAC-AlCl3 ionic liquids

Liu, Quan (1); Liu, Kui-Ren (1); Han, Qing (1); Tu, Gan-Feng (1)   

  1. (1) School of Materials and Metallurgy, Northeastern University, Shenyang 110004, China
  • Received:2013-06-20 Revised:2013-06-20 Online:2010-08-15 Published:2013-06-20
  • Contact: Liu, K.-R.
  • About author:-
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摘要： 采用以苯为助溶剂的TMPAC-AlCl3季铵盐室温离子液体,在铜上电镀铝.探讨了电流密度和电镀时间对镀铝层表观形貌和阴极电流效率的影响;通过极化曲线评价了镀铝层的耐蚀性,并采用扫描电镜,能量弥散X射线谱仪和X射线衍射仪等手段对样品进行表征.结果表明,在电流密度为15 mA/cm2,电镀时间为30 min条件下获得的镀铝层表面致密,阴极电流效率最高,达92%.阴极电流效率随电镀时间延长而下降,主要原因为AlCl3在Al阳极表面上的析出.极化曲线测试表明,镀铝层越厚,镀层的耐蚀性越好;厚度达17μm的镀铝层具有阳极钝化行为,可有效地保护基体.

关键词: 离子液体, 电沉积, 铝, 腐蚀, 极化曲线

Abstract: Al plating was electrodeposited on cupronickel alloy as substrate in the trimethyl-phenyl-ammonium chloride and anhydrous aluminum chloride (TMPAC-AlCl3) quaternary ammonium room temperature ionic liquids with benzene used as solubilizing assistant. The effects of current density and plating time on surface microscopic morphology and cathodic current efficiency were studied. The corrosion resistance of the as-deposited Al layer was evaluated by potentiodynamic polarization measurements. Moreover, scanning electron microscope, energy dispersion X-ray spectrometer and X-ray diffraction were used to characterize the samples. The results showed that the as-deposited Al plating obtained at 15 mA/cm2 for 30 min has a compact surface. Its cathodic current efficiency exhibits a maximum value up to 92% and decreases with increasing plating time mainly because of the precipitation of AlCl3 on the surface of Al anode. The polarization measurements showed that the thicker the Al plating, the higher the corrosion resistance of the plating. Moreover, the anodic passivation behavior of the as-deposited Al plating (17 μm thick) was found, which can effectively protect the substrate from corrosion.

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