东北大学学报(自然科学版) ›› 2022, Vol. 43 ›› Issue (10): 1453-1460.DOI: 10.12068/j.issn.1005-3026.2022.10.012

• 资源与土木工程 • 上一篇    下一篇

不同温度场下断层黏滑失稳过程模拟

赵永, 赵乾百, 王述红, 李友明   

  1. (东北大学 资源与土木工程学院, 辽宁 沈阳110819)
  • 修回日期:2021-09-29 接受日期:2021-09-29 发布日期:2022-11-07
  • 通讯作者: 赵永
  • 作者简介:赵永(1991-),男,山东临沂人,东北大学讲师; 王述红(1969-),男,江苏泰州人,东北大学教授,博士生导师.
  • 基金资助:
    国家自然科学基金资助项目(52004052); 中央高校基本科研业务费专项资金资助项目(N2101027).

Simulation of Fault Stick-Slip Instability Processes Under Different Temperature Fields

ZHAO Yong, ZHAO Qian-bai, WANG Shu-hong, LI You-ming   

  1. School of Resources & Civil Engineering, Northeastern University, Shenyang 110819, China.
  • Revised:2021-09-29 Accepted:2021-09-29 Published:2022-11-07
  • Contact: ZHAO Qian-bai
  • About author:-
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摘要: 随着国家对深部工程开发的需求增大,深部高岩温条件下断层黏滑失稳过程的演化规律和形成机制亟待研究.为此,本文借助离散元数值模拟手段,构建热力耦合数值模型,对6种不同温度场条件下的断层黏滑力学行为进行了详细研究,探究了不同温度场对断层黏滑失稳过程的影响机制.结果表明:随着温度场的不断上升,断层黏滑的破坏形态以及破坏模式均发生改变;断层黏滑次数、启滑应力以及启滑应力降整体上随温度上升,呈现不断下降的变化趋势;断层黏滑能量耗散以摩擦滑动为主;断层启滑时,总应变能与温度呈正相关,耗散能与温度呈负相关.

关键词: 断层黏滑;温度场;离散元;裂隙演化

Abstract: With the development of deep engineering in China, the evolution law and formation mechanism of fault stick-slip instability process in the deep area and high rock temperature need to be studied. Therefore, a numerical thermo-mechanical coupling model is constructed with discrete element code, the mechanical behavior of fault stick-slip under six different temperature fields was studied in detail, and the influence mechanism of different temperature fields on the process of fault stick-slip instability was explored. The results show that the failure patterns and failure modes of fault stick-slip change with the increase of temperature. The number of stick slip, initiation slip stress and initiation slip stress drop show an overall decreasing trend with increasing temperature. The energy dissipation of fault stick-slip is dominated by frictional sliding. When the fault starts sliding, the total strain energy is positively correlated with temperature, and the dissipated energy is negatively correlated with temperature.

Key words: fault stick-slip; temperature fields; discrete elements; fracture evolution

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