Abstract: Based on the boundary conditions of heat convection on plate surface during header cooling, a numerical simulation was done using the software ANSYS in combination with indirect temperature-stress coupling computation for the temperature field and stress/strain field in three different cooling processes. Comparing the different temperature-time histories and stress-strain curves on plate's cross section as resulting from simulation, the plate warping deformation due to three different cooling modes was analyzed. The results showed that the alternate cooling with big and small headers benefits the decrease in the temperature gradient along plate thickness, and the temperature gradient affects unobvious the plate warping. The cooling homogeneity on plate's top and bottom surfaces are the main cause for plate warping. The conclusion will provide a theoretical foundation to control the cooling process for plates.