Abstract: The curing behavior of allyl phenolic resin was analyzed at different heating rates using differential scanning calorimetry. The obtained kinetic data were treated by Kissinger and KAS(Kissinger-Akahira-Sunose) methods to obtain the curing reaction kinetic parameters. A curing kinetics model was established for allyl phenolic resin. Compared with phenolic resin, the curing temperature of allyl phenolic resin is higher, the reaction order is closer to 1, and the average activation energy of the curing reaction is lower, 111.45 kJ/mol. The activation energy of allyl phenolic resin is almost constant and changes little with temperature in the curing process. The curing kinetics model of allyl phenolic resin provides a theoretical basis for the study of curing process parameters.