东北大学学报（自然科学版）

东北大学学报(自然科学版) ›› 2007, Vol. 28 ›› Issue (3): 353-356.DOI: -

• 论著 • 上一篇    下一篇

A356铝合金半固态成形的数值模拟

路贵民;赵大志;王平;崔建忠;   

  1. 东北大学材料电磁过程研究教育部重点实验室;东北大学材料电磁过程研究教育部重点实验室;东北大学材料电磁过程研究教育部重点实验室;东北大学材料电磁过程研究教育部重点实验室 辽宁沈阳110004;辽宁沈阳110004;辽宁沈阳110004;辽宁沈阳110004
  • 收稿日期:2013-06-24 修回日期:2013-06-24 出版日期:2007-03-15 发布日期:2013-06-24
  • 通讯作者: Lu, G.-M.
  • 作者简介:-
  • 基金资助:
    国家自然科学基金资助项目(50374031)

Numerical simulation of semi-solid forming process of A356 alloy

Lu, Gui-Min (1); Zhao, Da-Zhi (1); Wang, Ping (1); Cui, Jian-Zhong (1)   

  1. (1) Key Laboratory of Electromagnetic Processing of Materials, Northeastern University, Shenyang 110004, China
  • Received:2013-06-24 Revised:2013-06-24 Online:2007-03-15 Published:2013-06-24
  • Contact: Lu, G.-M.
  • About author:-
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摘要： 利用ANSYS有限元模拟软件,通过对温度场与速度场的耦合数值模拟,分析了触变成形过程中充型温度对A356合金半固态浆料流动及温度分布的影响.模拟结果表明:当充型温度为590℃,压射速度为5 m/s时,半固态浆料充型平稳,没有形成喷溅和卷气现象,温度分布没有明显的热节区域形成,半固态浆料成形效果最理想,有利于获得充型完整、轮廓清晰、内部组织致密的半固态成形件.通过实验对数值模拟所获得的工艺参数进行了验证.

关键词: 半固态成形, 数值模拟, 温度场, 充型温度, 凝固, 充型过程

Abstract: The FEA software ANSYS was applied to the numerical simulation coupling temperature field with velocity field to analyze the effect of mold filling temperature on the flow and temperature distribution of semi-solid slurry of A356 alloy during thixo-forming. The results showed that the semi-solid slurry is stable in filling process without spouting, air entrapment and hot spot area found in temperature distribution if the mold filling temperature is 590°C with an injecting rate 5 m/s. Such conditions are ideal to the forming of semi-solid A356 alloy slurry because they are beneficial to getting fully filled semi-solid parts with clear contour and compact microstructure. The technological parameters obtained from numerical simulation are verified by tests.

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