东北大学学报（自然科学版）

东北大学学报(自然科学版) ›› 2007, Vol. 28 ›› Issue (9): 1302-1304.DOI: -

• 论著 • 上一篇    下一篇

电磁软接触连铸圆坯结晶器磁场分布数值模拟研究(Ⅰ)——数学物理模型及数值计算结果的实验验证

李本文;孙洋;邓安元;赫冀成;   

  1. 东北大学材料电磁过程研究教育部重点实验室;东北大学材料电磁过程研究教育部重点实验室;东北大学材料电磁过程研究教育部重点实验室;东北大学材料电磁过程研究教育部重点实验室 辽宁沈阳110004;辽宁沈阳110004;辽宁沈阳110004;辽宁沈阳110004
  • 收稿日期:2013-06-24 修回日期:2013-06-24 出版日期:2007-09-15 发布日期:2013-06-24
  • 通讯作者: Li, B.-W.
  • 作者简介:-
  • 基金资助:
    国家高技术研究发展计划项目(2001AA337040)

Numerical simulation of magnetic flux density distributions in soft-contacting EMCC round billet. Part I: Mathematical/physical models and the validation of numerical results

Li, Ben-Wen (1); Sun, Yang (1); Deng, An-Yuan (1); He, Ji-Cheng (1)   

  1. (1) Key Lab. of National Education Ministry for Electromagnetic Processing of Materials, Northeastern University, Shenyang 110004, China
  • Received:2013-06-24 Revised:2013-06-24 Online:2007-09-15 Published:2013-06-24
  • Contact: Li, B.-W.
  • About author:-
  • Supported by:
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摘要： 描述了自行设计的电磁软接触圆坯连铸结晶器,给出了相应的三维圆坯连铸结晶器电磁软接触电磁场的数学模型.采用有限元方法对数学模型进行数值求解,在对数值计算结果进行实验验证后,系统地研究三维圆坯连铸结晶器内磁场分布.数值解与实验结果误差小于5%.分别考察了结晶器结构参数,钢液液面高度、电流强度等参数对结晶器内磁场分布的影响.定量地得到了结晶器内磁感应强度随各种结构参数和操作参数变化的规律.为电磁软接触连铸圆坯结晶器的设计和实际操作提供了理论依据.

关键词: 软接触, 电磁连铸, 结晶器, 电磁场, 磁感应强度, 数值模拟

Abstract: A very close to realistic production soft-contact EMCC (electromagnetic continuous casting) round billet mold was introduced, and the corresponding three dimensional mathematical model for electromagnetic fields was developed. The mathematical model was numerically solved using finite element method under well-posed conditions. After the validation of numerical results by experiments, the three dimensional distributions of magnetic flux density in the soft-contacting EMCC mold were systematically investigated. The errors between numerical and experimental values are less than 5 percent. The relations between magnetic flux density and all structural and operational parameters are obtained quantitatively, which will provide a theoretical quidance to the design and operation of soft-contacting EMCC round billet mold.

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