Journal of Northeastern University ›› 2008, Vol. 29 ›› Issue (4): 529-532.DOI: -

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Effect of TSCR parameters on microstructure of Fe-3%Si strip

Yu, Yong-Mei (1); Li, Chang-Sheng (1); Xu, Yun-Bo (1); Wang, Guo-Dong (1)   

  1. (1) State Key Laboratory of Rolling and Automation, Northeastern University, Shenyang 110004, China
  • Received:2013-06-22 Revised:2013-06-22 Online:2008-04-15 Published:2013-06-22
  • Contact: Yu, Y.-M.
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Abstract: TSCR (thin slab casting and rolling) simulation was conducted for the Fe-3% Si strip to investigate the effects of different TSCR parameters on its hot rolling process and normalized microstructure. The results showed that the cross-sectional microstructure is inhomogeneous. When the specimen is rolled after 1200°C for 20 min insulation and under the first two heavier pass reductions and pass reductions decreasing, as a result, the microstructure shows more recrystallized grains which are homogeneously distributed and finer in transition layer with no lengthened band structure found in middle layer. Such a microstructure is advantageous to secondary recrystallization. Compared with the strip by conventional hot rolling process, the average grain size is 1.5 μm bigger, and the dislocation arrangement and the top and middle microstructure look similar. It is important that the microstructure of the hot-rolled strip makes sure of that after normalization.

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