Journal of Northeastern University ›› 2012, Vol. 33 ›› Issue (12): 1722-1725.DOI: -

• OriginalPaper • Previous Articles     Next Articles

Changes of crystal structure in Ti thin films during N implantation

Wang, Jian-Jun (1); Kasukabe, Yoshitaka (2); Liu, Chun-Ming (1)   

  1. (1) School of Materials and Metallurgy, Northeastern University, Shenyang 110819, China; (2) Center for International Exchange, Tohoku University, Sendai 980-8576, Japan
  • Received:2013-06-19 Revised:2013-06-19 Published:2013-04-04
  • Contact: Wang, J.-J.
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Abstract: Ti thin films were deposited by electron beam deposition(EBD) method on the cleaned NaCl substrates, and were implanted with 62 keV N2+ by an accelerator. Changes of crystal structures in Ti thin films were analyzed for those samples before and after N implantation. TEM results showed that hcp-fcc transformation is induced due to the invasion of N atoms into Ti thin films, and hence parts of hcp-Ti in films are changed into fcc-TiNy. Implanted N atoms occupy the octahedral-sites in the crystal lattices and lead to lattice distortion, which supports inner stress as one of the possible driving force for hcp-fcc transformation. With the N/Ti ratio increasing, the amount of hcp-Ti decreases and that of fcc-TiNy increases. Changes in energy loss for Ti films were measured by EELS, and it is suggested that Ti atoms and implanted N atoms are combined into TiNy compounds for the bonding of the outer N 2p covalent electrons and Ti 3p-4s hybrid orbitals.

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