Journal of Northeastern University(Natural Science) ›› 2021, Vol. 42 ›› Issue (3): 389-395.DOI: 10.12068/j.issn.1005-3026.2021.03.013

• Mechanical Engineering • Previous Articles     Next Articles

Dynamic Thermal Mechanical Coupling Effect in Disc Grinding and Its Influence on Workpiece Material Removal Process

XIU Shi-chao, LU Yue, SUN Cong, LI Qing-liang   

  1. School of Mechanical Engineering & Automation, Northeastern University, Shenyang 110819, China.
  • Received:2020-07-01 Revised:2020-07-01 Accepted:2020-07-01 Published:2021-03-12
  • Contact: SUN Cong
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Abstract: A theoretical modeling method based on dynamic thermal mechanical coupling effect is proposed for the thermodynamic distribution characteristics of contact surfaces in disc grinding. Firstly, the mathematical model of movement trajectory of multiple abrasive grains is established. Then, the surface grinding force of the workpiece is modeled analytically based on the dynamic distribution characteristics of movement trajectory and the height of effective abrasive grains. Subsequently, the dynamic thermal mechanical coupling process on the workpiece surface is analyzed with the finite difference method (FDM) according to the grinding force. Lastly, the finite element method (FEM) and disc grinding experiment are applied to verify the rationality of the theoretical analysis respectively. The results show that the workpiece surface profile height is different due to the homogenization degree of the dynamic thermal mechanical coupling. The workpiece surface profile can be improved by reducing the speed of grinding wheels.

Key words: disc grinding; dynamic thermal mechanical coupling effect; movement trajectory; grinding force; workpiece surface profile

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