Preparation of Microcylindrical Array Tool Electrode with Large Aspect Ratio

doi:10.12068/j.issn.1005-3026.2025.20240107

Abstract

Abstract:

In view of the difficulty and complexity in the preparation of microcylindrical array electrodes with a large aspect ratio， a new process method with multiple iterations based on the special phenomenon of rounded cross-section caused by galvanic corrosion of micro-normal tetragonal electrodes was proposed， so as to achieve high-quality and high-efficiency preparation of microcylindrical array electrodes with a large aspect ratio.The feasibility of the method was verified experimentally， and the effects of different electrode materials （copper and copper-tungsten alloy） on the processing performance were compared.The results show that fewer iterations are required for the iterative preparation of microcylindrical array electrodes for copper electrodes compared with copper-tungsten alloys.The large aspect ratios of the prepared 6 $×$ 6 microcylindrical array electrodes of prepared copper and copper-tungsten alloy are 6.08 and 8.81， respectively， and the standard deviations of the diameters of circular holes in the processed array are 8.48 μm and 8.18 μm， respectively.

Key words: microcylinder, microprism, array electrode, circular hole in array, electrical discharge machining

CLC Number:

TG 132.3

Li-ya JIN, Ya-dong GONG, Rong-di ZHU, Hong-fei GAO. Preparation of Microcylindrical Array Tool Electrode with Large Aspect Ratio[J]. Journal of Northeastern University(Natural Science), 2025, 46(11): 98-105.

Figures/Tables 14

Fig.1 Processing results of microprismatic array electrodes

Fig.2 Schematic diagram of microcylindrical array electrode processing method

Fig.3 Effect of numbers of processing operations on axial wear length of microprismatic array electrodes

Fig.4 Time required to process microarray holes for microprismatic array electrodes of different materials

Fig.5 Morphological analysis of electrode loss in microprismatic arrays

Fig.6 Loss length of microprismatic array electrodes of different materials

Fig.7 Morphology of microarray electrodes of copper-tungsten alloy in transition stage

Fig.8 Effect of numbers of iterations on microarray hole exit during copper electrode processing

Fig.9 Effect of number of iterations on microarray hole exit during copper-tungsten alloy electrode processing

Fig.10 6×6 microcylindrical array electrodes of different materials

Fig.11 Dimensions of circular holes in processed array from electrodes of different materials

Fig.12 Surface microscopic morphology of

Fig.13 Line profile and surface roughness of electrodes of different materials

Fig.14 EDS analysis of copper electrode surfaces

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