Surface Quality and Forming Accuracy of Monocrystalline Silicon Microstructures by Electrical Discharge Machining

doi:10.12068/j.issn.1005-3026.2025.20230253

Abstract

Abstract:

Taking the electrical discharge machining （EDM） of P-type monocrystalline silicon as the experimental subject， the surface morphology features and microscopic discharge pit characteristics of the monocrystalline silicon were investigated. It was revealed that the material removal mechanism of the monocrystalline silicon is dominated by stress erosion， which is more significant than melting and vaporization erosion. An experimental research on EDM of monocrystalline silicon microstructures， including micro-grooves and micro-holes， was done to explore the forming accuracy， size deviations， fluctuation height of the cross-sectional profiles， and surface quality of the EDM-processed microstructures， revealing the influence of the main processing parameters on the material removal rate， surface morphology， and surface roughness of the EDM-processed monocrystalline silicon.

Key words: monocrystalline silicon, electrical discharge machining, micro-groove, micro-hole, surface morphology, forming accuracy

CLC Number:

TG 661

Yao SUN, Jun-yi DONG, Ben-jia TANG, Si-hui LI. Surface Quality and Forming Accuracy of Monocrystalline Silicon Microstructures by Electrical Discharge Machining[J]. Journal of Northeastern University(Natural Science), 2025, 46(2): 96-103.

Figures/Tables 11

Fig. 1 Experimental equipment and schematic diagram

Table 1 Factors and levels for micro-groove of the monocrystalline silicon

因素	水平
因素	1	2	3	4
I_p/A	40	110	230	320
T_on/μs	4	6	13	15
F_w/N	9	12	15	16

Fig. 2 2D / 3D morphology of the micro-spiral tool

Fig. 3 Surface morphology of the monocrystalline silicon machined by EDM

Fig. 4 Surface morphology of the monocrystalline silicon machined by low-speed wire EDM with various Ip

Fig. 5 Surface roughness of the monocrystalline silicon machined by LS-WEDM with various Ip

Fig. 6 Ra and RMR of the monocrystalline silicon machined by LS-WEDM

Fig. 7 Inlet and outlet morphology of the monocrystalline silicon micro-hole machined by EDM

Fig. 8 Changed trend of the inlet and outlet diameters of the micro-holes

Fig. 9 Spiral microelectrode after fabricating the monocrystalline silicon micro-holes

Fig. 10 Cross-sectional profiles and three-dimensional surface of the micro-holes on the monocrystalline silicon machined by EDM

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