关键词: 铝热还原, 真空, 锶, 氧化锶, 碳酸锶

Abstract: On the basis of thermal decomposition of SiCO3 influences of various technological parameters on reduction rate in the process of reduction were investigated. It was found that with the increase of reduction temperature, reduction rate increases up to 82% at 1200°C, and reduction rate increases fast at the beginning (the first 1-3 h) with prolonging reduction time then it increases gently in the successive 1-2 h. With the same activity, the finer the grain size of reducing agent, the higher the reduction rate. Although the reduction rate increases with amount of reducing agent, but there is a peak value of reduction rate and, exceeding it the rate will not increases, but decrease with the increase of the amount of reducing agent. In general reduction rate can be up to 75% even to 82% as maximum. Such a result can meet the requirement of actual production.