东北大学学报(自然科学版) ›› 2022, Vol. 43 ›› Issue (9): 1255-1262.DOI: 10.12068/j.issn.1005-3026.2022.09.006

• 机械工程 • 上一篇    下一篇

基于分步耦合的压电分流薄板动力学建模与分析

刘钺, 孙伟, 黎明   

  1. (东北大学 机械工程与自动化学院, 辽宁 沈阳110819)
  • 发布日期:2022-09-16
  • 通讯作者: 刘钺
  • 作者简介:刘钺(1996-),男,辽宁鞍山人,东北大学硕士研究生; 孙伟(1975-),男,辽宁营口人,东北大学教授,博士生导师.
  • 基金资助:
    中央高校基本科研业务费专项资金资助项目(N180312012).

Dynamic Modeling and Analysis of Piezoelectric Shunt Thin Plates Based on Step-by-Step Coupling

LIU Yue, SUN Wei, LI Ming   

  1. School of Mechanical Engineering & Automation, Northeastern University, Shenyang 110819, China.
  • Published:2022-09-16
  • Contact: SUN Wei
  • About author:-
  • Supported by:
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摘要: 为了有效实施压电分流阻尼减振,创建一个能预估其减振效果的动力学分析模型以指导减振设计.根据压电分流薄板结构,提出了一种将基体结构和分流电路分别建模并通过压电片将二者耦合起来的分步耦合建模方法.在ANSYS软件平台上,详细描述了面向压电分流薄板结构采用分步耦合法的建模流程.实验验证了建模方法的合理性,压电分流阻尼对结构具有较好的减振效果,降低共振响应幅度可达50%以上.分析了电感值、压电片贴敷位置、压电片面积等参数对薄板振动响应的影响.结果表明:对于电阻-电感串联及并联分流电路,存在一个最优的电感值可使薄板减振效果最优;压电片贴在变形较大的区域及增大压电片尺寸对减振有利.

关键词: 分步耦合;压电分流;薄板结构;减振分析;ANSYS仿真

Abstract: In order to effectively implement piezoelectric shunt damping vibration, a dynamic analysis model which can estimate the vibration reduction effect is created to guide the vibration reduction design. A step-by-step coupling modeling method for piezoelectric shunt thin plate structures is proposed, in which the substrate structure and shunt circuit are modeled separately and the two are coupled by piezoelectric patches. Based on the ANSYS software platform, the modeling process of piezoelectric shunt thin plates with step-by-step coupling is described in detail. The experiment verifies the rationality of the modeling method, and the piezoelectric shunt damping has a good vibration reduction effect, which reduces the resonance response by more than 50%. The influence of inductance values, piezoelectric patch position and area on the vibration response of the thin plate is analyzed. The results show that for resistance-inductors in series and parallel shunt circuits, there is an optimal inductance value to optimize the vibration reduction effects of thin plates. The piezoelectric patch is attached to a larger region and increases the piezoelectric sheet size to vibration reduction.

Key words: step-by-step coupling; piezoelectric shunt; thin plate structure; vibration reduction analysis; ANSYS simulation

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