Physical Simulation of Emulsion Phenomena in Copper Side-blown Smelting Process

doi:10.12068/j.issn.1005-3026.2018.05.009

Abstract

Abstract: In order to quantitatively describe the emulsion phenomena， a physical model was built up based on the similarity law. Then a high-resolution camera and Image Pro-Plus 6.0 software were utilized to record the emulsion phenomena and analyze the effect of gas flow rate on the emulsified drops size distribution. Finally， an estimation method of the interfacial area ɑ was given. The results show that the Sauter mean diameter (SMD) of emulsified drops decreases with the increasing of gas flow rate. The interfacial area of emulsion layer almost linearly increases with the gas flow rate and the separation of matte and slag is caused by gravity and mass transfer.

Key words: physical simulation, oxygen-enriched side-blown, copper, emulsion, SMD of droplets, interfacial area

CLC Number:

TF811

LI Xiao-long， LIU Yan， WANG Dong-xing， ZHANG Ting-an. Physical Simulation of Emulsion Phenomena in Copper Side-blown Smelting Process[J]. Journal of Northeastern University Natural Science, 2018, 39(5): 649-653.

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