Journal of Northeastern University ›› 2005, Vol. 26 ›› Issue (3): 282-284.DOI: -

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Two-steps electroless nickel plating of magnesium alloys

Li, Jian-Zhong (1); Shao, Zhong-Cai (2); Hao, Jian-Jun (1); Tian, Yan-Wen (1)   

  1. (1) Sch. of Mat. and Metall., Northeastern Univ., Shenyang 110004, China; (2) Faculty of Environ. and Chem. Eng., Shenyang Ligong Univ., Shenyang 110168, China
  • Received:2013-06-24 Revised:2013-06-24 Online:2005-03-15 Published:2013-06-24
  • Contact: Tian, Y.-W.
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Abstract: The two-step electroless nickel plating (TSENP) of magnesium alloys using NiSO4·6H2O as the main salt was introduced. The morphology, composition and phase structure of TSENP coatings were investigated by means of Scanning Electron Microscopy (SEM), Energy Dispersive X-ray Spectroscopy (EDS) and X-ray Diffraction (XRD). In addition, the coating growth rate was tested through weighing by electro-balance and the bonding strength between coating and substrate was evaluated through file-checking. The results showed that the plating of magnesium alloys with NiSO4·6H2O solution as the main salt, i. e., the 2nd step should be carried out successively 4 minutes after the direct land electroless nickel plating (DENP). It was verified that the coating growth rate of single DENP is lower than that of TSENP, the sheeny TSENP coating is of high-phosphorus amorphism with higher corrosion resistance and bonding strength than DENP coating. The P content in weight is effectively distributed in the coating. In short, TSENP will not only decrease the cost but improve the applicability.

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