[1]Lupu N.Electrodeposited nanowires and their applications [M].Croatia :InTech, 2010:61-64,86,214-215. [2]Zhang L D,Fang X S,Ye C H.Controlled growth of nanomaterials [M].Singapore :World Scientific,2007:167-175,269-272. [3]Huang C C,Lo C C,Tseng Y C,et al.Magnetostructural phase transition in electroless-plated Ni nanoarrays [J].Journal of Applied Physics,2011,109(11):113905-1-13905-7. [4]Geckeler K E,Nishide H.Advanced nanomaterials [M].Weinheim :Wiley-VCH,2010:200-202. [5]倪星元,姚兰芳,沈军,等.纳米材料制备技术[M].北京:化学工业出版社,2007:259.(Ni Xing-yuan,Yao Lan-fang,Shen Jun,et al.Preparation technology of nano material [M].Beijing:Chemical Industry Press,2007:259.) [6]Wu S S,Liu W L,Tsai T K,et al.Growth behavior of electroless copper on silicon substrate [J].Journal of University of Science and Technology Beijing,2007,14(1):67-71. [7]Niazi A R,Li S K,Wang Y C,et al.Parameters optimization of electroless deposition of Cu on Cr-coated diamond [J].Transactions of Nonferrous Metals Society of China,2014,24(1):136-145. [8]任鑫,黄新民,张胡海,等.化学沉积法制备铜纳米管与纳米线[J].金属功能材料,2006,13(5):1-4.(Ren Xin,Huang Xin-min,Zhang Hu-hai,et al.Fabrication of Cu nanotubes and nanowires by electroless deposition [J].Metallic Functional Materials,2006,13(5):1-4.) [9]赵文珍.材料表面工程导论[M].西安:西安交通大学出版社,1998:221-225.(Zhao Wen-zhen.Introduction to materials’ surface engineering [M].Xi’an:Xi’an Jiaotong University Press,1998:221-225.) [10]胡文彬,刘磊,仵亚婷.难镀基材的化学镀镍技术[M].北京:化学工业出版社,2003:115-117.(Hu Wen-bin,Liu Lei,Wu Ya-ting.Technology of electroless nickel plating on difficult-to-plate substrates [M].Beijing:Chemical Industry Press,2003:115-117.)