Journal of Northeastern University(Natural Science) ›› 2024, Vol. 45 ›› Issue (6): 802-807.DOI: 10.12068/j.issn.1005-3026.2024.06.006

• Materials & Metallurgy • Previous Articles    

Effect of SiCp Particle Size Grading on the Microstructure and Properties of 55%SiCp/6061Al Composites

Meng-qi WANG1,2, Yue LIU1(), Chun-lin XIAO3, Chun-ming LIU1,2   

  1. 1.School of Materials Science & Engineering,Northeastern University,Shenyang 110819,China
    2.Key Laboratory of Material Anisotropy and Texture,Ministry of Education,Northeastern University,Shenyang 110819,China
    3.Liaoning Lanyu New Material Co. ,Ltd. ,Tieling 112606,China.
  • Received:2022-02-24 Online:2024-06-15 Published:2024-09-18
  • Contact: Yue LIU
  • About author:LIU Yue, E-mail: db‑dx555@163.com

Abstract:

55%SiCp/6061Al (55% is volume fraction) composites were prepared using the vacuum hot pressing method. The effects of SiCp particle size on distribution uniformity,density and bending strength of the composites were investigated. The results showed that composites with particle size grading have a dense microstructure,uniform SiCp distribution and high interfacial bonding strength between SiCp and the 6061Al alloy matrix. The bending strength of (60+25) μm composite with a mass ratio of 4∶1 raises from 395 MPa to 548 MPa. The bending strength of (120+60+25) μm composite with a mass ratio of 1∶1∶1 is the highest,reaching 397 MPa. The double grain size grading (106+25) μm composite with a mass ratio 4∶1 exhibits excellent comprehensive properties,with density>99.00%,uniformity>90.00% and bending strength>400 MPa after heat treatment.

Key words: 55%SiCp/6061Al composite, vacuum hot pressing, grain size grading, uniformity, density, bending strength

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