东北大学学报(自然科学版) ›› 2025, Vol. 46 ›› Issue (3): 28-45.DOI: 10.12068/j.issn.1005-3026.2025.20240182

• 材料与冶金 • 上一篇    下一篇

半导体制程设备铝合金涂层腐蚀失效行为研究进展

赵阳, 王宇航, 张涛(), 王福会   

  1. 东北大学 数字钢铁全国重点实验室,辽宁 沈阳 110819
  • 收稿日期:2024-10-16 出版日期:2025-03-15 发布日期:2025-05-29
  • 通讯作者: 张涛
  • 作者简介:赵 阳(1989—),男,辽宁鞍山人,东北大学副教授,博士生导师
    张 涛(1977—),男,辽宁阜新人,东北大学教授,博士生导师.
  • 基金资助:
    国家自然科学基金资助项目(52371055)

Research Progress on the Corrosion Failure Behavior of Coatings on Aluminum Alloy for Semiconductor Fabrication Equipment

Yang ZHAO, Yu-hang WANG, Tao ZHANG(), Fu-hui WANG   

  1. State Key Laboratory of Digital Steel,Northeastern University,Shenyang 110819,China. cn

摘要:

在半导体制程设备中,在高温、真空、强腐蚀气体及其等离子体耦合作用下,铝合金涂层极易发生失效.在氯基等离子体中,阳极氧化涂层极易被刻蚀去除,Y2O3涂层的刻蚀速率约为阳极氧化涂层的1/50;在氟基等离子体中,阳极氧化涂层和Y2O3涂层均存在氟化物层剥落导致的颗粒问题.通过调节电解液的成分/温度、制备纯铝层可提高阳极氧化涂层的耐蚀性能,提高Y2O3涂层的致密性同样可降低涂层的刻蚀速率,结合远程等离子体清洗技术,避免带电粒子轰击腔室材料,可显著减少反应腔室中颗粒的产生.在刻蚀和薄膜沉积过程中,腔室表面成分发生变化,进而改变等离子体状态,将引发多种工艺缺陷.

关键词: 半导体制程设备, 阳极氧化涂层, Y2O3涂层, 腐蚀失效行为, 卤素气体, 等离子体

Abstract:

In the semiconductor fabrication equipment, the coatings on aluminum alloy often fail due to the coupling effect of high-temperature, vacuum and aggressive gases, including their plasma. In the chlorine-based plasma, the anodized coating has a high etching rate, leading to rapid removal, while the etching rate of Y2O3 coatings is approximately one in 50 of that of the anodized coating. In the fluorine-based plasma, both the anodized coating and Y2O3 coatings experience particle contamination due to the fluoride layer peeling. The corrosion resistance of the anodized coating can be significantly enhanced by adjusting the composition and temperature of the electrolyte or depositing a pure aluminum layer on the aluminum alloy surface. Additionally, improving the density of Y2O3 coatings can reduce their etching rate. Combining these strategies with remote plasma cleaning techniques can minimize the impact of charged particles on chamber materials, significantly reducing particle contamination in the reaction chamber. During the etching and thin film deposition processes, changes in the chamber surface composition can alter the plasma state, leading to various process defects.

Key words: semiconductor fabrication equipment, anodized coating, Y2O3 coating, corrosion fatigue behavior, halogen gas, plasma

中图分类号: