Journal of Northeastern University Natural Science ›› 2017, Vol. 38 ›› Issue (7): 983-988.DOI: 10.12068/j.issn.1005-3026.2017.07.015

• Mechanical Engineering • Previous Articles     Next Articles

Experimental Study on Influencing Factor of Surface Quality in Micro Side Grinding of Single Crystal Silicon

ZHOU Yun-guang1, GONG Ya-dong2, GAO Qi2, ZHU Zong-xiao2   

  1. 1. School of Control Engineering, Northeastern University at Qinhuangdao, Qinhuangdao 066004, China; 2. School of Mechanical Engineering & Automation, Northeastern University, Shenyang 110819, China.
  • Received:2016-02-02 Revised:2016-02-02 Online:2017-07-15 Published:2017-07-07
  • Contact: ZHOU Yun-guang
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Abstract: To obtain the microstructure of single crystal silicon with a good surface quality, the single crystal silicon was grinded along the (100) crystal plane with microscale grinding technology by using microgrinding tool with diameter of 0.9 mm. Firstly, the main influence factors on microgrinding surface roughness of single crystal silicon were analyzed by the orthogonal experiment with three factors and five levels. Then, the microgrinding process was optimized to obtain minimum surface roughness. Lastly, the effect of process parameters on the surface roughness (Ra) of microgrinding single crystal silicon was analyzed through single-factor experiment. The results show that: in the microgrinding process (20000r/min≤vs≤60000r/min, 20μm/s≤vw≤170μm/s and 3μm≤ap≤15μm) along (100) crystal plane of single crystal silicon, the influence of spindle speed on Ra was maximum; when the spindle speed (vs) was 50000r/min, feeding rate (vw) was 20μm/s, grinding depth (ap) was 3μm, Ra was minimum; Ra reduces basically with the increase of vs, but if vs was too large, the spindle appeared vibration, Ra showed the tendency of increase. Ra raises with the increase of vw and ap.

Key words: micro machining, micro grinding, single crystal silicon, grinding surface quality, surface roughness

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