Dynamic Modeling and Analysis of Piezoelectric Shunt Thin Plates Based on Step-by-Step Coupling

doi:10.12068/j.issn.1005-3026.2022.09.006

Abstract

Abstract: In order to effectively implement piezoelectric shunt damping vibration， a dynamic analysis model which can estimate the vibration reduction effect is created to guide the vibration reduction design. A step-by-step coupling modeling method for piezoelectric shunt thin plate structures is proposed， in which the substrate structure and shunt circuit are modeled separately and the two are coupled by piezoelectric patches. Based on the ANSYS software platform， the modeling process of piezoelectric shunt thin plates with step-by-step coupling is described in detail. The experiment verifies the rationality of the modeling method， and the piezoelectric shunt damping has a good vibration reduction effect， which reduces the resonance response by more than 50%. The influence of inductance values， piezoelectric patch position and area on the vibration response of the thin plate is analyzed. The results show that for resistance-inductors in series and parallel shunt circuits， there is an optimal inductance value to optimize the vibration reduction effects of thin plates. The piezoelectric patch is attached to a larger region and increases the piezoelectric sheet size to vibration reduction.

Key words: step-by-step coupling; piezoelectric shunt; thin plate structure; vibration reduction analysis; ANSYS simulation

CLC Number:

LIU Yue， SUN Wei， LI Ming. Dynamic Modeling and Analysis of Piezoelectric Shunt Thin Plates Based on Step-by-Step Coupling[J]. Journal of Northeastern University(Natural Science), 2022, 43(9): 1255-1262.

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