东北大学学报（自然科学版）

东北大学学报:自然科学版 ›› 2020, Vol. 41 ›› Issue (2): 252-257.DOI: 10.12068/j.issn.1005-3026.2020.02.018

• 机械工程 • 上一篇    下一篇

2.5D Cf/SiC复合材料磨削工艺试验研究

屈硕硕， 巩亚东， 杨玉莹， 舍跃斌   

  1. (东北大学 机械工程与自动化学院， 辽宁 沈阳110819)
  • 收稿日期:2019-04-24 修回日期:2019-04-24 出版日期:2020-02-15 发布日期:2020-03-06
  • 通讯作者: 屈硕硕
  • 作者简介:屈硕硕(1991-)，男，山东济南人，东北大学博士研究生； 巩亚东(1958-)，男，辽宁本溪人，东北大学教授，博士生导师.
  • 基金资助:
    国家自然科学基金资助项目(51775100)； 中央高校基本科研业务费专项资金资助项目(N180306001).

Research on Grinding Process Performance of 2.5D Cf/SiC

QU Shuo-shuo， GONG Ya-dong， YANG Yu-ying， SHE Yue-bin   

  1. School of Mechanical Engineering & Automation， Northeastern University， Shenyang 110819， China.
  • Received:2019-04-24 Revised:2019-04-24 Online:2020-02-15 Published:2020-03-06
  • Contact: GONG Ya-dong
  • About author:-
  • Supported by:
    -

RichHTML

0

PDF (PC)

777

摘要： 为研究2.5D Cf/SiC复合材料的磨削工艺性能，设计并完成了单因素试验.结果表明:磨削深度ap、砂轮线速度vs及进给速度vw均对2.5D Cf/SiC的磨削性能评价参数(表面形貌、表面粗糙度及磨削力)产生影响，其中磨削深度对评价参数的影响最大，进给速度影响最小；经向纤维及纬向纤维的支撑效果具有很大差异，导致不同的磨削加工缺陷形式；2.5D Cf/SiC的主要缺陷形式包括界面脱粘、裂纹、纤维露头及拔除；不同加工参数及纤维方向会导致磨屑出现一定的差异.根据试验结果对2.5D Cf/SiC的磨削加工机理进行了考察分析，为2.5D Cf/SiC的磨削加工理论的研究提供了重要的技术支撑.

关键词: 2.5D Cf/SiC, 表面形貌, 表面粗糙度, 磨削力, 磨削机理

Abstract: To study the grinding process performance of 2.5D Cf/SiC composites， single factor tests were designed and executed. The results show that grinding depth， wheel speed and feed speed have prominent influence on the processing performance evaluation parameters， including surface topography， surface roughness and grinding force. It also implies that the grinding depth is the maximal influence factor， while feed speed is the minimal one. Due to difference of supporting effects of the warp fiber and weft fiber， the defect forms on the machined surface are different. The mainly surface defects of 2.5D Cf/SiC contain interfacial debonding， crack， fiber outcrop and pullout. In addition， different grinding chips would be produced with different grinding parameters and fiber orientations. According to the experimental results， the grinding mechanism of 2.5D Cf/SiC was researched in detail， which supplies significantly technical support for investigation on the grinding theory of 2.5D Cf/SiC.

Key words: objective, interval particle, interval2.5D Cf/SiC, surface topography, surface roughness, grinding force, grinding mechanism

中图分类号: