Abstract: To study the grinding process performance of 2.5D C_f/SiC composites， single factor tests were designed and executed. The results show that grinding depth， wheel speed and feed speed have prominent influence on the processing performance evaluation parameters， including surface topography， surface roughness and grinding force. It also implies that the grinding depth is the maximal influence factor， while feed speed is the minimal one. Due to difference of supporting effects of the warp fiber and weft fiber， the defect forms on the machined surface are different. The mainly surface defects of 2.5D C_f/SiC contain interfacial debonding， crack， fiber outcrop and pullout. In addition， different grinding chips would be produced with different grinding parameters and fiber orientations. According to the experimental results， the grinding mechanism of 2.5D C_f/SiC was researched in detail， which supplies significantly technical support for investigation on the grinding theory of 2.5D C_f/SiC.

Key words: objective, interval particle, interval2.5D C_f/SiC, surface topography, surface roughness, grinding force, grinding mechanism